DARPA’s Perrseus Program: Manufacturable µUHV for Quantum & Atomic Sensors
The Defense Advanced Research Projects Agency (DARPA) Perrseus program is now live with a formal solicitation, moving from concept to concrete timelines and technical expectations. The goal hasn’t changed: build manufacturable, microscale ultra‑high‑vacuum (µUHV) packages that can support next‑generation quantum, MEMS, and photonics‑based sensors without relying on room‑sized vacuum systems. With the solicitation out, teams […]
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